Samsung Unveils HBM5 and zHBM Roadmap, Targeting 200-% and 800-% Performance Gains
At the heart of the latest semiconductor sprint, Samsung Electronics took center stage at SEMICON Taiwan on September 1,...
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Samsung Unveils 400-Layer BV-NAND and zHBM Memory for AI Workloads
When Samsung Electronics unveiled a 400‑layer memory prototype on August 4 2026, it signaled a quiet but decisive step...
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KOSPI Plunges 40% as Memory Trade Reverses; SK Hynix Survives with Strong Q2 Results
The Korea Composite Stock Price Index (KOSPI) fell about 40 % from its June peak, triggering a series of circuit‑break...
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Cadence Expands Intel Foundry Collaboration, Boosts HBM4 IP Portfolio Amid AI Chip Demand
Cadence Design Systems (NASDAQ: CDNS) announced on June 8 2026 that it had broadened its partnership with Intel Foundry ...
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