Blab Tech
Teledyne FLIR OEM Unveils Boson SX8: First NDAA-Compliant 8-m Pixel LWIR Module with SXGA Resolution
Teledyne FLIR OEM, a unit of Teledyne Technologies Incorporated, announced on 9 June 2026 that it is shipping the Boson SX8, the first long‑wave infrared (LWIR) thermal camera module that is both NDAA‑compliant and ITAR‑free while offering an 8‑µm pixel pitch and 1280 × 1024 (SXGA) resolution. The module is aimed at size, weight, and power (SWaP)‑constrained defense and industrial systems and will be showcased at Eurosatory 2026 in Paris.
The Boson SX8 is built on an 8‑µm pixel architecture that shrinks pixel area by 55 % compared with the standard 12‑µm LWIR pixel format. According to the company, the smaller pixel size delivers industry‑best thermal performance while quadrupling the resolution of today’s high‑volume, uncooled VGA (640 × 512) modules. The module maintains a compact package size, allowing it to fit in the same form factor as existing uncooled systems.
"By pairing this advanced 8‑µm pixel architecture with SXGA thermal resolution at full‑rate production, we’re giving customers greater situational awareness and longer effective range without compromising SWaP or supply‑chain confidence," said Paul Clayton, President of Teledyne FLIR OEM.
The Boson SX8 family targets applications that have traditionally required heavier, larger, and more power‑hungry cooled mid‑wave infrared (MWIR) systems. The company lists uncrewed aircraft systems (UAS), counter‑UAS, perimeter security, handheld devices, seekers, visual augmentation, and intelligence, surveillance, and reconnaissance (ISR) platforms as key use cases.
A variant of the module, the Boson SX8‑CZ 15–75, incorporates a factory‑integrated 5× continuous‑zoom (CZ) lens. The 15–75 mm lens is engineered and calibrated as a single system, providing focus‑through‑zoom, thermal gradient compensation, factory alignment, and a single‑source warranty. The integration is intended to reduce integration risk and accelerate time to market.
Manufacturing of both the Boson SX8 and the Boson SX8‑CZ 15–75 is carried out at high volume in the United States by Teledyne FLIR OEM, the world’s leading supplier of OEM thermal camera modules. The company emphasizes that the modules are designed for production deployment, offering a low‑risk path from development through full‑rate manufacturing. Teledyne FLIR OEM also provides integration with its Prism™ intelligent embedded software products.
Teledyne FLIR OEM will demonstrate the Boson SX8 product family at Eurosatory 2026, where attendees can experience the latest advances in high‑definition, SWaP‑optimized thermal imaging.
Teledyne FLIR OEM is a subsidiary of Teledyne Technologies Incorporated (NYSE: TDY). The company is the largest volume manufacturer of ITAR‑free and NDAA‑compliant infrared sensor and camera modules. It delivers thousands of thermal imaging modules and related software tools daily for defense, automotive, uncrewed, professional, and artificial‑intelligence applications.
In summary, the Boson SX8 represents the first volume‑produced, NDAA‑compliant LWIR module that delivers 8‑µm pixel resolution at SXGA level. The module is available for integration, will be showcased at Eurosatory 2026, and is supported by Teledyne FLIR OEM’s Prism software and U.S. manufacturing capabilities. No regulatory actions or court proceedings are currently pending, and the product is positioned for deployment across a broad range of defense and industrial applications.
The Boson SX8 is built on an 8‑µm pixel architecture that shrinks pixel area by 55 % compared with the standard 12‑µm LWIR pixel format. According to the company, the smaller pixel size delivers industry‑best thermal performance while quadrupling the resolution of today’s high‑volume, uncooled VGA (640 × 512) modules. The module maintains a compact package size, allowing it to fit in the same form factor as existing uncooled systems.
"By pairing this advanced 8‑µm pixel architecture with SXGA thermal resolution at full‑rate production, we’re giving customers greater situational awareness and longer effective range without compromising SWaP or supply‑chain confidence," said Paul Clayton, President of Teledyne FLIR OEM.
The Boson SX8 family targets applications that have traditionally required heavier, larger, and more power‑hungry cooled mid‑wave infrared (MWIR) systems. The company lists uncrewed aircraft systems (UAS), counter‑UAS, perimeter security, handheld devices, seekers, visual augmentation, and intelligence, surveillance, and reconnaissance (ISR) platforms as key use cases.
A variant of the module, the Boson SX8‑CZ 15–75, incorporates a factory‑integrated 5× continuous‑zoom (CZ) lens. The 15–75 mm lens is engineered and calibrated as a single system, providing focus‑through‑zoom, thermal gradient compensation, factory alignment, and a single‑source warranty. The integration is intended to reduce integration risk and accelerate time to market.
Manufacturing of both the Boson SX8 and the Boson SX8‑CZ 15–75 is carried out at high volume in the United States by Teledyne FLIR OEM, the world’s leading supplier of OEM thermal camera modules. The company emphasizes that the modules are designed for production deployment, offering a low‑risk path from development through full‑rate manufacturing. Teledyne FLIR OEM also provides integration with its Prism™ intelligent embedded software products.
Teledyne FLIR OEM will demonstrate the Boson SX8 product family at Eurosatory 2026, where attendees can experience the latest advances in high‑definition, SWaP‑optimized thermal imaging.
Teledyne FLIR OEM is a subsidiary of Teledyne Technologies Incorporated (NYSE: TDY). The company is the largest volume manufacturer of ITAR‑free and NDAA‑compliant infrared sensor and camera modules. It delivers thousands of thermal imaging modules and related software tools daily for defense, automotive, uncrewed, professional, and artificial‑intelligence applications.
In summary, the Boson SX8 represents the first volume‑produced, NDAA‑compliant LWIR module that delivers 8‑µm pixel resolution at SXGA level. The module is available for integration, will be showcased at Eurosatory 2026, and is supported by Teledyne FLIR OEM’s Prism software and U.S. manufacturing capabilities. No regulatory actions or court proceedings are currently pending, and the product is positioned for deployment across a broad range of defense and industrial applications.
