Blab Tech
Hesis Wins TIPS Selection, Launches Mass-Production of Nano-Carbon Thermal Management for Semiconductor Plants
On June 30 2026, the Ministry of SMEs and Startups announced that Hesis, a fledgling firm from Hannam University’s Business Incubation Center, had earned a coveted spot in its flagship TIPS program. The decision marks a milestone in the company’s quest to bring its nano‑carbon thermal‑management system to full‑scale production.
Hesis has been steadily building a portfolio of support from both academia and government. In October 2025, Hannam University Technology Holdings injected a seed round, followed by a second funding wave from the Daejeon Center for Creative Economy and Innovation in April 2026. Earlier that year, the startup also secured placement in the Ministry’s Startup Growth (Didimdol) R&D program and the Pre‑TIPS pilot scheme, setting the stage for the full TIPS award.
The core of Hesis’s offering lies in a nano‑carbon material that can be woven into piping used to transport chemicals and gases inside semiconductor fabs. By delivering tighter temperature control, the system promises to boost yield, cut energy usage, and lower carbon footprints—two metrics that are increasingly central to fab operators.
"With this selection for the TIPS program as a turning point, we will focus on further advancing the performance of our products and securing the stability and durability that customers can trust," CEO Jang Sang‑hyun said. "Through cooperation with major domestic and international semiconductor manufacturers, we will carry out technology verification and secure customer references to further strengthen our competitiveness in the global market."
In line with the program’s goals, Hesis has already expanded its production footprint this year, establishing a mass‑production line and beginning to ship canister heaters overseas. The move signals the company’s readiness to meet the demand of fabs that are actively seeking more energy‑efficient thermal‑control solutions.
Won Gu‑hwan, CEO of Hannam University Technology Holdings, added, "We will continue to discover excellent technology startups and revitalize the regional technology startup ecosystem by linking investment with growth support." The statement underscores the university’s broader commitment to nurturing high‑potential ventures.
The TIPS initiative, a government‑led effort, offers startups a blend of funding, mentorship, and market‑access assistance. Hesis’s inclusion indicates that regulators view its nano‑carbon platform as a commercially viable product with a clear path to market.
Industry analysts point out that semiconductor fabs are under mounting pressure to reduce both energy consumption and carbon emissions. Technologies that tighten temperature control in critical process steps are therefore in high demand. Hesis’s solution, which targets the piping that carries process chemicals and gases, fills a niche that has traditionally relied on bulk heating or cooling methods.
The company’s first export of canister heaters marks a tangible step into international markets. While sales figures remain undisclosed, the move suggests that Hesis is positioning itself to secure orders from fabs outside South Korea.
The Daejeon Center for Creative Economy and Innovation, part of a regional push to establish Daejeon as a technology hub, invested in Hesis with the aim of accelerating the commercialization of promising technologies.
Hesis’s nano‑carbon material is designed to deliver superior thermal conductivity while remaining chemically compatible with the harsh environments inside fabs. The platform is described as a next‑generation solution that can simultaneously enhance productivity and eco‑friendliness of semiconductor processes.
Beyond funding, the TIPS program provides Hesis with access to a network of investors, mentors, and potential customers. The support is expected to help the startup refine its product, scale production, and secure pilot projects with major fabs.
At present, Hesis has not announced specific customer names or pilot dates. The company’s next steps will likely involve demonstration projects with domestic and international semiconductor manufacturers, as well as further development of its product line to meet regulatory and performance standards.
In summary, Hesis has secured a key government program placement, expanded its production capacity, and begun exporting its thermal‑management heaters. The company’s nano‑carbon technology is positioned to address energy‑efficiency and carbon‑reduction needs in semiconductor manufacturing, and the TIPS program is expected to accelerate its commercial rollout. The startup’s progress will be closely watched as it moves toward pilot deployments and larger production orders.
Hesis has been steadily building a portfolio of support from both academia and government. In October 2025, Hannam University Technology Holdings injected a seed round, followed by a second funding wave from the Daejeon Center for Creative Economy and Innovation in April 2026. Earlier that year, the startup also secured placement in the Ministry’s Startup Growth (Didimdol) R&D program and the Pre‑TIPS pilot scheme, setting the stage for the full TIPS award.
The core of Hesis’s offering lies in a nano‑carbon material that can be woven into piping used to transport chemicals and gases inside semiconductor fabs. By delivering tighter temperature control, the system promises to boost yield, cut energy usage, and lower carbon footprints—two metrics that are increasingly central to fab operators.
"With this selection for the TIPS program as a turning point, we will focus on further advancing the performance of our products and securing the stability and durability that customers can trust," CEO Jang Sang‑hyun said. "Through cooperation with major domestic and international semiconductor manufacturers, we will carry out technology verification and secure customer references to further strengthen our competitiveness in the global market."
In line with the program’s goals, Hesis has already expanded its production footprint this year, establishing a mass‑production line and beginning to ship canister heaters overseas. The move signals the company’s readiness to meet the demand of fabs that are actively seeking more energy‑efficient thermal‑control solutions.
Won Gu‑hwan, CEO of Hannam University Technology Holdings, added, "We will continue to discover excellent technology startups and revitalize the regional technology startup ecosystem by linking investment with growth support." The statement underscores the university’s broader commitment to nurturing high‑potential ventures.
The TIPS initiative, a government‑led effort, offers startups a blend of funding, mentorship, and market‑access assistance. Hesis’s inclusion indicates that regulators view its nano‑carbon platform as a commercially viable product with a clear path to market.
Industry analysts point out that semiconductor fabs are under mounting pressure to reduce both energy consumption and carbon emissions. Technologies that tighten temperature control in critical process steps are therefore in high demand. Hesis’s solution, which targets the piping that carries process chemicals and gases, fills a niche that has traditionally relied on bulk heating or cooling methods.
The company’s first export of canister heaters marks a tangible step into international markets. While sales figures remain undisclosed, the move suggests that Hesis is positioning itself to secure orders from fabs outside South Korea.
The Daejeon Center for Creative Economy and Innovation, part of a regional push to establish Daejeon as a technology hub, invested in Hesis with the aim of accelerating the commercialization of promising technologies.
Hesis’s nano‑carbon material is designed to deliver superior thermal conductivity while remaining chemically compatible with the harsh environments inside fabs. The platform is described as a next‑generation solution that can simultaneously enhance productivity and eco‑friendliness of semiconductor processes.
Beyond funding, the TIPS program provides Hesis with access to a network of investors, mentors, and potential customers. The support is expected to help the startup refine its product, scale production, and secure pilot projects with major fabs.
At present, Hesis has not announced specific customer names or pilot dates. The company’s next steps will likely involve demonstration projects with domestic and international semiconductor manufacturers, as well as further development of its product line to meet regulatory and performance standards.
In summary, Hesis has secured a key government program placement, expanded its production capacity, and begun exporting its thermal‑management heaters. The company’s nano‑carbon technology is positioned to address energy‑efficiency and carbon‑reduction needs in semiconductor manufacturing, and the TIPS program is expected to accelerate its commercial rollout. The startup’s progress will be closely watched as it moves toward pilot deployments and larger production orders.
